Irvine Sensors Corporation (ISC) has been involved in development of components and systems for use in imaging LIDAR since its inception. Key technologies include 3D stacked electronics, 3D imaging lasers, and advanced surveillance processing based on large focal plane arrays. ISC's 3D stacking techniques provide inherent benefits for detector-to-ROIC interfacing such as greatly reduced capacitance allowing higher bandwidth, higher fill factor by pushing circuitry into ROIC, and increased electronics integration by orthogonal bonding of detector and ROIC.
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